Sub-micron precision manufacturing

Specialized machining processes optimized for semiconductor supply-chain partners and industrial OEMs.

5-Axis Precision Milling

Wire EDM Cutting

Custom Jig Fabrication

Complex geometry fabrication handling titanium, Inconel, and engineering polymers with calibrated coordinate measuring validation.

High-accuracy profile generation for delicate semiconductor tooling modules and hardened die components.

Modular assembly fixtures engineered for high-throughput automated production lines and cleanroom environments.

Four-stage fabrication sequence

CAD Ingestion & DFM

Toolpath Generation

Calibrated CMM Inspection

Clean-Pack Dispatch

Direct submission review analyzing material compatibility, tolerance stacking, and machining feasibility within one business day.

Advanced CAM programming optimized for high-speed material removal and minimal thermal distortion.

Rigorous dimensional verification on calibrated coordinate measuring equipment prior to surface treatment.

Anti-static vacuum sealing and protective packaging ensuring contamination-free delivery to Hsinchu facilities.

Submit technical drawings for cycle time estimation

Our engineering desk responds directly with material feasibility and batch pricing.